Interfacial Thermal Conductance of Transfer-Printed Metal Films

Author

Dong-Wook Oh , Seok Kim , John A. Rogers , David G. Cahill , and Sanjiv Sinha

Journal

Advanced Materials

Publication Date

11/16/2011

Abstract

The thermal conductance of transfer-printed interfaces is found to be surprisingly high, only a factor of 2–10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer-printing and provide fundamental insights on the nature of solid-solid contacts between elastically stiff materials.

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Date added: 2012-10-24 10:12:11 | Last time updated: 2012-10-24 08:12:11 | Viewed: 937 times

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