Microcontact printing and pattern transfer with a tri-layer processing

Author

hen, Y. and Lebib, A. and Carcenac, F. and Launois, H. and Schmidt, G. and Tormen, M. and Muller, G. and Molenkamp, L.W. and Liebau, M. and Huskens, J. and Reinhoudt, D.N.

Journal

Microelectronic Engineering

Publication Date

06/01/2000

Abstract

We describe a new approach of microcontact printing which is based on a tri-layer processing. The replication process has four steps: (1) preparation of gold-PMMA-substrate by sputtering and spincoating deposition; (2) pattern transfer with alkanethiol molecules from a PDMS stamp to gold; (3) wet etching of gold and (4) reactive ion etching of under-layer PMMA. By this method, we succeeded in fabricating microstructures in PMMA resist which are suitable for further hard material pattern transfers, thereby providing an enhanced process compatibility with most of microfabrication steps

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Date added: 2012-10-04 09:51:24 | Last time updated: 2012-10-04 07:51:24 | Viewed: 995 times

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