Direct photochemical formation of Cu patterns on surface modified polyimide resin


Shingo Ikeda , Kensuke Akamatsu and Hidemi Nawafune


Journal of Materials Chemistry

Publication Date



A novel method is presented for the direct metallization of Cu on to surface modified polyimide resin by photochemical reduction of copper(II) ions with the aid of pre-adsorbed colloidal TiO2 as photocatalyst: for the first time copper circuit patterns are successfully fabricated simply by using a quartz-on-glass photomask without the requirement for a photoresist

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Date added: 2012-08-22 17:47:58 | Last time updated: 2012-08-22 15:47:58 | Viewed: 878 times

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