Microcontact printing was used to pattern silicon, aluminum, and titanium substrates using octadecyltrichlorosilane as the ink and an elastomer as the stamp. Patterns were transferred into the substrates using both dry and wet etching. The Al and Ti were etched using an electron cyclotron resonance (ECR) plasma source at low ion energies and low pressure. Silicon was etched in HF to remove the native oxide, followed by KOH. Microcontact printing using OTS ink is a convenient and easy way to pattern both semiconductor and metal surfaces without the extended use of photolithography.