Direct photochemical formation of Cu patterns on surface modified polyimide resin

Abstract

A novel method is presented for the direct metallization of Cu on to surface modified polyimide resin by photochemical reduction of copper(II) ions with the aid of pre-adsorbed colloidal TiO2 as photocatalyst: for the first time copper circuit patterns are successfully fabricated simply by using a quartz-on-glass photomask without the requirement for a photoresist.

Link

Direct photochemical formation of Cu patterns on surface modified polyimide resin